For the launch of PICC (Private Innovation Competence Center), we offer a 30 day trial, including :
- A 5 user license for the Knowledge Map* module
- Cloud access only
- User training to get started traight away
- Hotline
At a special price of 900 CHF (64% discount, valid until June 30th).
TO BENEFIT FROM THIS EXCLUSIVE 30 DAY OFFER
Want to try out our solutions? Please fill out the following form, an expert will contact you as soon as possible.
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PICC solution aims to capitalize on a company’s knowledge and experience to solve complex problems and to approach innovation systematically.
* PICC is divided into 3 modules :
. The Knowledge Map, included in the current offer, ideal to capitalize on knowledge, bring together different interlocutors around a given situation, practical, fluid to use, adapted to mobility and international structures, thanks to semantic research …
. The Build & Solve, based on the method of systematic innovation, accompanies you in the analysis of a problem, even complex, up to its resolution, going through the analysis of the situation in time, taking into account the environment, subcomponents, constraints and needs in the short or long term …
All the dimensions of the problem are highlighted to make the best strategic choices, either in incremental evolution or in disruption.
Measuring creativity levels, weighing choices, knowing the history of decisions, making evolutions and innovations robust and reliable.
. External Knowledge Map, with artficial intelligence, automatic of data from internal or external documents, automatically, with prior validation of the documentalist expert (P.I./watch/ ..). Thus the structuring of documentary knowledge becomes exploitable and integrable to your daily need.
PICC, IS ALSO A SOLUTION ON WHICH YOU CAN COUNT, IN THE PURSUIT OF THESE OBJECTIVES :
• Capitalization on Know-How.
• Solving complex problems
• Decision-making & Stratégie.
• Technology Forecasting.
• Preventive maintenance.
• Managing connected objects.
• International collaborative project.
• Encapsulation of patents.
• …